VISION MARK-1 SOLDER PASTE and CONFORMAL COATING Fitness for use products

The Vision MARK-1 for Solder Paste Quality Control provides rapid, small sample solder paste measurements for quality control solutions.

Applications

Prior to Printing Quality Control
Reduce printing and reflow defects by monitoring solder paste quality before printing.

In Process Paste Condition Monitoring
Increase line utilization by extending stencil life of solder paste. Avoid unnecessary setups and wasted solder paste caused by premature disposal.

Printing Defect Troubleshooting and Root Cause Analysis
Quickly eliminate solder paste as the root cause of defects in your manufacturing process.

Benefits

Quick Detection of Paste Quality
Verify correct solder paste handling throughout shipping, storage, and use.
Catch defective paste that may cause short stencil life, poor tack, solder balling, nonwetting, and de-wetting.

Extend Solder Paste Stencil Life
Directly determine end of solder paste stencil life to increase line utilization

Small-Sample Requirements
Requires only 5 grams of solder paste

Rapid Measurement
Receive measurement results in under 4 minutes

Clear Control Indicators
Customizable process control limits with red, yellow, and green light indicators

Correlates to Standards
Measurements correlate to J-STD-005 standards and TM-650 test methods

Vision MARK-1 with E-Chem Insight and Probe - SP Results

Principle of Operation

Conformal coating quality control measurements use dielectric spectroscopy to measure the dielectric properties of a conformal coating. The probe is filled with a sample of coating and a small electrical signal is applied to measure the Coating Consistency Index (CCI), or impedance response, of the coating. The CCI is correlated with the solvent content of the coating. CCI values are compared against a custom material calibration to determine the thinning level.